Develop a fully automated and highly scalable disruptive PIC packaging and test technology which provides a greater than 10 times reduction in PIC production costs and use the disruptive technology to design and produce a revolutionary PIC package.
Technology Challenge: Current Photonic Integrated Circuit (PIC) packaging processes typically rely on package-by-package or ‘package-level’ processes, where optical and electrical interconnects are completed when the photonic device has already been placed in the mechanical package. This serial style process flow is difficult to automate and has limited throughput, with scale-up in production directly related to the number of packaging machines used.
Project Solution: PhotonicLEAP overcomes the current PIC packaging and test bottleneck by developing a truly disruptive production technology using advanced glass packaging materials and fully automated wafer-level packaging and test processes which can be scaled to very large volumes. PhotonicLEAP will use this disruptive technology to produce a revolutionary Surface Mount Technology (SMT) PIC package, based on a Ball Grid Array (BGA) design. SMT is the most widely used, cost-effective and standardised package in the electronics world, and PhotonicLEAP’s standardised SMT approach is set to follow, becoming a new global standard for cost-effective PIC packaging.
Expert Consortium: The project will be delivered by a highly experienced consortium with an unmatched record of excellence in realising many world firsts in PIC packaging, test technologies and services. The consortium brings a wealth of the interdisciplinary skills and state-of-the-art infrastructure required to deliver on the project’s ambitious objectives. The project uses this interdisciplinary approach to advance the technologies well beyond what is achievable by one partner alone.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved