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We were in Laser World of Photonics 2023 Expo in Munich. Our partner, Fraunhofer IZM, promoted the wafer-level thin glass packaging results of PhotonicLEAP.
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Our PhotonicLEAP partner, SUSS MicroOptics, presented the project's objectives and results so far at PIC INTERNATIONAL 2023 conference in Brussels.
The wafer-level packaging results of our EU project PhotonicLEAP demonstrated at Photonics West 2023 by our partners from Fraunhofer IZM.
An article about our project is published in Optics magazine.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved.