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Meet us at OFC in San Francisco, where Prof. Peter O’Brien will be giving Short Course SC525 entitled “Photonic and Electronic Packaging – Materials, Processes, Equipment and Reliability” (Monday 31st March). Check details on the OFC website for registration.
Fraunhofer-IZM presented their PhotonicLEAP Wafers at the ECOC 2024 exhibition in Frankfurt, Germany, with Berlin Partner, where they were well received. IZM is planning to take part again at ECOC 2025 (in Copenhagen), with contributions both in congress and exhibition, showcasing PhotonicLEAP demonstrators.
We were in Laser World of Photonics 2023 Expo in Munich. Our partner, Fraunhofer IZM, promoted the wafer-level thin glass packaging results of PhotonicLEAP. Tyndall National Institute's Prof Peter O'Brien gave an OPTICA-sponsored packaging tutorial, including an overview of the PhotonicLEAP project and latest project results.
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Tyndall PhD student, Parnika Gupta, won the best student paper award at the IEEE 3DID conference (Cork, May 2023) for her work on packaging of photonic and electronic devices on the PhotonicLEAP glass interposer technology.
Our PhotonicLEAP partner, SUSS MicroOptics, presented the project's objectives and results so far at PIC INTERNATIONAL 2023 conference in Brussels.
The wafer-level packaging results of our EU project PhotonicLEAP demonstrated at Photonics West 2023 by our partners from Fraunhofer IZM.
An article about our project is published in Optics magazine.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved.