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Fraunhofer-IZM will share a booth with Berlin Partner for Business and Technology at ECOC 2025 in Copenhagen, Denmark. They will present there PhotonicLEAP's final results and demonstrators. If you want to know more, you can meet the IZM team on stands C2110 and C2310.
Fraunhofer-IZM presented their latest PhotonicLEAP Interposer Wafers at the Laser World of Photonics 2025 exhibition in Munich, Germany, where they were well received. IZM is planning to take part again at ECOC 2025 (in Copenhagen), with contributions both in congress and exhibition, showcasing PhotonicLEAP demonstrators.
in June 2025, the project met at the Technical University of Eindhoven to review the Electro-Optic Test System developed to evaluate the packages produced in the PhotonicLEAP project. TU Eindhoven, in collaboration with ficonTEC, has now developed an impressive automated package pick-and-place and electro-optic test capability. Tyndall is leading the development of PhotonicLEAP's novel glass-based packages (both InP- and SOI-based PICs in glass BGA-style packages).
PhotonicLEAP's research on the development of state-of-the-art glass electrical interposers for photonic-electronic packaging has been published in the leading international packaging magazine Chip Scale Review and on its cover page - image shows flipchip packaging of photonic chip on glass interposer and alignment of microlens array with integrated micro prisms for out-of-plane coupling. Access the full article here.
Meet us at OFC in San Francisco, where Prof. Peter O’Brien will be giving Short Course SC525 entitled “Photonic and Electronic Packaging – Materials, Processes, Equipment and Reliability” (Monday 31st March). Check details on the OFC website for registration.
In February 2025, the PhotonicLEAP project consortium partners met at Tyndall Institute in Cork. Here, Josue Parra from FiconTEC is demonstrating to partners the latest microlens packaging to InP photonic chips developed through the project. FiconTEC Ireland's labs are co-located with Tyndall Photonics Packaging Group, allowing for a deep collaboration between our teams.
Fraunhofer-IZM presented their PhotonicLEAP Wafers at the ECOC 2024 exhibition in Frankfurt, Germany, with Berlin Partner, where they were well received. IZM is planning to take part again at ECOC 2025 (in Copenhagen), with contributions both in congress and exhibition, showcasing PhotonicLEAP demonstrators.
We were in Laser World of Photonics 2023 Expo in Munich. Our partner, Fraunhofer IZM, promoted the wafer-level thin glass packaging results of PhotonicLEAP. Tyndall National Institute's Prof Peter O'Brien gave an OPTICA-sponsored packaging tutorial, including an overview of the PhotonicLEAP project and latest project results.
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Tyndall PhD student, Parnika Gupta, won the best student paper award at the IEEE 3DID conference (Cork, May 2023) for her work on packaging of photonic and electronic devices on the PhotonicLEAP glass interposer technology.
Our PhotonicLEAP partner, SUSS MicroOptics, presented the project's objectives and results so far at PIC INTERNATIONAL 2023 conference in Brussels.
The wafer-level packaging results of our EU project PhotonicLEAP demonstrated at Photonics West 2023 by our partners from Fraunhofer IZM.
An article about our project is published in Optics magazine.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved.