High level objectives of PhotonicLEAP
Develop a fully automated, highly scalable and cost-effective disruptive PIC packaging and test technology.
Use this disruptive technology to design and produce a revolutionary PIC package based on the global standard Surface Mount Technology (SMT) package, which for the first time will incorporate multiple optical and electrical connections.
Validate this disruptive technology through state-of-the-art demonstrators selected from areas addressing emerging socio-economic challenges, including communications, healthcare and security.
Develop standardised packaging design rules formalised into an Open Access Process Design Kit (PDK), providing users with easy access to the technology through European Open Access and commercial PIC design software tools.
Use this disruptive technology to design and produce a revolutionary PIC package based on the global standard Surface Mount Technology (SMT) package, which for the first time will incorporate multiple optical and electrical connections.
Validate this disruptive technology through state-of-the-art demonstrators selected from areas addressing emerging socio-economic challenges, including communications, healthcare and security.
Develop standardised packaging design rules formalised into an Open Access Process Design Kit (PDK), providing users with easy access to the technology through European Open Access and commercial PIC design software tools.
Project Details
Start Date: January 2021
Duration: 48 months
Duration: 48 months
The PhotonicLEAP project develops core technologies, moving them from TRL 3 to 5, demonstrating fully working processes and application demonstrators. Also, the project will prepare a PhotonicLEAP package PDK which will be shared with initiatives such as PIXAPP, enabling pilot users to evaluate the technology during the project. This engagement with the PIXAPP requires PhotonicLEAP’s package PDK to be operating at TRL6, ready for pilot scale production.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved