Find here details of PhotonicLEAP's publications and conferences presentations
"High Aspect Ratio Through-Glass Vias as Heat Conductive Element," K. Kröhnert et al., 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), Gothenburg, Sweden, 2022, pp. 1-6.
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"Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages," P. Gupta et al., 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania, 2022, pp. 391-397, doi: 10.1109/ESTC55720.2022.9939531.
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"Reference Thermal Chips for 2D and 3D Co-packaging Process Development," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), P. Gupta et al., Orlando, FL, USA, 2023, pp. 2160-2165, doi: 10.1109/ECTC51909.2023.00372.
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"Thermal Management Strategies for Co-Packaged Optics on Glass Interposers in Next-Generation Photonic Packaging," P. Gupta et al., Conference Proceedings, 2023 IEEE International 3D Systems Integration Conference (3DIC), Cork, Ireland, 2023, pp. 1-65, doi: 10.1109/3DIC57175.2023.10155106.
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"Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages", Parnika Gupta, Amit Tanwar, Xiuyun He, Kamil Gradkowski, Kafil M. Razeeb, Padraic E. Morrissey, Peter O’Brien, J. Optical Microsystems 4(1) 011006 (5 January 2024).
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“Hybrid Integration of Laser Source to Photonic Integrated Circuit using Expanded Beam Approach”, Chirag M. Patil, Martin Pfeiffer, Wilfried Noell, Padraic E. Morrissey, Peter O’Brien, Photonics Ireland Conference 2023, University of Limerick, September 2023.
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“LAB: Challenges and Opportunities for Photonics Integration” How Yuan Hwang, Kevin Shortiss, Josue Parra, Peter O’Brien, Photonics Ireland Conference 2023, University of Limerick, September 2023.
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Integrated Photonics Packaging: Challenges and Opportunities, Luigi Ranno, Parnika Gupta, Kamil Gradkowski, Robert Bernson, Drew Weninger, Samuel Serna, Anuradha Murthy Agarwal, Lionel C. Kimerling, Juejun Hu, and Peter Obrien; ACS Photonics, 9 (11), 2022.
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“Demonstration of Single-Mode Expanded Beam Connectorised Module for Photonic Integrated Circuits”, K. Gradkowski at al., IEEE, Journal of Lightwave Technology, February 2023.
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“Microlens-Assisted Expanded Beam Technique for Coupling of Laser Source to Photonic Integrated Circuit”, Chirag M. Patil, How Yuan Hwang, Martin Pfeiffer, Wilfried Noell, Padraic E. Morrissey, and Peter O’Brien, 28th Micro Optics Conference, Miyazaki, Japan, September 2023.
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M. Ghomashi, R. Baets, Y. Li, Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits, 2023 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD), Italy, doi:10.1109/NUSOD59562.2023.10273523 (2023)
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This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved.
This project has received funding from the European Union’s Horizon 2020 research and innovation program Grant Agreement N°101016738, in Public Private Partnership with Photonics 21 (www.photonics21.org) Copyright © 2021 PhotonicLEAP All rights reserved.